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ZHCSVB7N December 1995 – July 2024 SN54AHC540 , SN74AHC540

PRODUCTION DATA

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

DGV|20
DB|20
N|20
DW|20
PW|20

散热焊盘机械数据 (封装 | 引脚)

订购信息

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHC540						UNIT
		DB (SSOP)	DGV (TVSOP)	DW (SOIC)	N (PDIP)	NS (PDIP)	PW (TSSOP)
		20 PINS	20 PINS	20 PINS	20 PINS	20 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	99.9	119.2	81.1	54.9	80.4	116.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	61.7	34.5	48.9	41.7	46.9	58.5	°C/W
R_θJB	Junction-to-board thermal resistance	55.2	60.7	53.8	35.8	47.9	78.7	°C/W
ψ_JT	Junction-to-top characterization parameter	22.6	1.2	19.5	27.9	19.9	12.6	°C/W
ψ_JB	Junction-to-board characterization parameter	54.8	60.0	53.1	35.7	47.5	77.9	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).