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ZHCSS63R October 1995 – February 2024 SN54AHCT04 , SN74AHCT04

PRODMIX

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHCT04								UNIT
		D	DB	DGV	N	NS	PW	RGY	BQA
		14 PINS
R_θJA	Junction-to-ambient thermal resistance	124.5	113.1	138.7	61.1	120.9	147.7	63.7	88.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	78.8	65.6	60.6	48.0	78.2	77.4	77.6	90.9
R_θJB	Junction-to-board thermal resistance	81	60.4	71.8	41.0	81.6	90.9	39.7	56.8
ψ_JT	Junction-to-top characterization parameter	37	25.5	10.6	32.4	42.8	27.2	5.7	9.9
ψ_JB	Junction-to-board characterization parameter	80.6	59.9	71.1	40.9	81.1	90.2	39.9	56.7
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	N/A	19.9	33.4

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, (SPRA953).