ZHCSS34P October 1995 – October 2023 SN54AHCT08 , SN74AHCT08
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | SNx4AHCT08 | UNIT | |||||
|---|---|---|---|---|---|---|---|
| D (SOIC) | DB (SSOP) | DGV (TVSOP) | N (PDIP) | BQA (WQFN) | |||
| 14 PINS | 14 PINS | 14 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 124.5 | 109.5 | 133.3 | 59.7 | 88.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 78.8 | 62.1 | 55.6 | 47.3 | 90.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 81 | 56.9 | 66.3 | 39.5 | 56.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 37 | 22.6 | 7.8 | 32.4 | 9.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 80.6 | 56.3 | 56.6 | 39.4 | 56.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | N/A | °C/W |