ZHCSTE2S March   1996  – February 2024 SN74AHCT1G08

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
  • DCK|5
  • DRL|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 4.5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
VI Input voltage 0 5.5 V
VO Output voltage 0 VCC V
IOH High-level output current –8 mA
IOL Low-level output current 8 mA
Δt/Δv Input transition rise and fall rate 20 ns/V
TA Operating free-air temperature –40 125 °C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).