ZHCSTE2S March   1996  – February 2024 SN74AHCT1G08

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
  • DCK|5
  • DRL|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision R (October 2023) to Revision S (February 2024)

  • Updated thermal values for DBV package from RθJA = 226 to 278, RθJC(top) = 165 to 180.5, RθJB = 59.1 to 184.4, ΨJT = 45.5 to 115.4, ΨJB = 58.3 to 183.4, RθJC(bot) = N/A, all values in °C/W Go

Changes from Revision Q (April 2016) to Revision R (October 2023)

  • 更新了整个文档中的表、图和交叉参考的编号格式Go
  • Updated thermal values for DCK package from RθJA = 277.5 to 289.2, RθJC(top) = 92.9 to 205.8, RθJB = 64.2 to 176.2, ΨJT = 1.9 to 117.6, ΨJB = 63.5 to 175.1, RθJC(bot) = N/A, all values in °C/W Go