10 Revision History
Changes from Revision O (October 2023) to Revision P (March 2024)
- 向封装信息 表中添加了本体尺寸Go
- Updated thermal values for DBV package from RθJA = 231.3 to 278,
RθJC(top) = 119.9 to 180.5, RθJB = 60.6 to 184.4, ΨJT = 17.8 to 115.4, ΨJB =
60.1 to 183.4, RθJC(bot) = N/A, all values in °C/W Go
Changes from Revision N (January 2016) to Revision O (October 2023)
- 更新了整个文档中的表格、图和交叉参考的编号格式Go
- Updated thermal values for DCK package from RθJA = 287.6 to 289.2,
RθJC(top) = 97.7 to 205.8, RθJB = 65 to 176.2, ΨJT = 2.0 to 117.6, ΨJB = 64.2 to
175.1, RθJC(bot) = N/A, all values in °C/W Go