米6体育平台手机版

ZHCSSI6 july 2023

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHCT245-EP	UNIT
		PW
		20 PINS
R_θJA	Junction-to-ambient thermal resistance	102.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	36.8
R_θJB	Junction-to-board thermal resistance	53.8
ψ_JT	Junction-to-top characterization parameter	2.5
ψ_JB	Junction-to-board characterization parameter	53.3
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.