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ZHCSWZ8N December 1995 – August 2024 SN54AHCT540 , SN74AHCT540

PRODUCTION DATA

1
1 特性
2 说明
3 Pin Configuration and Functions
4 Specifications
5 Parameter Measurement Information
6 Detailed Description
7 Application and Implementation
1. 7.1 Power Supply Recommendations
2. 7.2 Layout
  1. 7.2.1 Layout Guidelines
  2. 7.2.2 Layout Example
8 Device and Documentation Support
9 Revision History
10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

DGV|20
DB|20
NS|20
N|20
DW|20
PW|20

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcswz8n_oa
zhcswz8n_pm

4.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHCT540						UNIT
		DB (SSOP)	DGV (TVSOP)	DW (SOIC)	N (PDIP)	NS (PDIP)	PW (TSSOP)
		20 PINS	20 PINS	20 PINS	20 PINS	20 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	70	92	58	69	60	116.8	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).