ZHCSSM0N October   1995  – July 2024 SN54AHCT574 , SN74AHCT574

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Related Links
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGV|20
  • DB|20
  • NS|20
  • N|20
  • PW|20
  • DW|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1)SN74AHCT574UNIT
DW (SOIC)DB (SSOP)DGV (TVSOP)N (PDIP)NS (SOP)PW (TSSOP)
20 PINS
RθJAJunction-to-ambient thermal resistance81.197.9117.253.379.2116.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance48.959.632.740.045.758.5
RθJBJunction-to-board thermal resistance53.853.158.734.246.878.7
ψJTJunction-to-top characterization parameter19.521.31.1526.419.312.6
ψJBJunction-to-board characterization parameter53.152.758.034.146.477.9
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/AN/AN/A
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).