ZHCSQX3M March 2002 – August 2022 SN74AUC1G125
PRODUCTION DATA
| THERMAL METRIC(1) | DBV (SOT-23) | DCK (SC70) | YZP (DSBGA) | UNIT | |
|---|---|---|---|---|---|
| 5 PINS | 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 220.7 | 262.5 | 144.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 123.9 | 181.4 | 1.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 123.20 | 153.4 | 47.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 58.3 | 67.60 | 0.6 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 122.5 | 152.80 | 47.5 | °C/W |