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SCES387L march 2002 – June 2017 SN74AUC1G79

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.

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机械数据 (封装 | 引脚)

DBV|5
DCK|5

散热焊盘机械数据 (封装 | 引脚)

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage		–0.5	3.6	V
V_I	Input voltage⁽²⁾		–0.5	3.6	V
V_O	Voltage range applied to any output in the high-impedance or power-off state⁽²⁾		–0.5	3.6	V
V_O	Output voltage range⁽²⁾		–0.5	V_CC + 0.5	V
I_IK	Input clamp current	V_I < 0		–50	mA
I_OK	Output clamp current	V_O < 0		–50	mA
I_O	Continuous output current			±20	mA
	Continuous current through V_CC or GND			±100	mA
T_stg	Storage temperature		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	2000	V
		Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	1000
		Machine Model (A115-A)	200

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

See⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage		0.8	2.7	V
V_IH	High-level input voltage	V_CC = 0.8 V	V_CC		V
		V_CC = 1.1 V to 1.95 V	0.65 × V_CC
		V_CC = 2.3 V to 2.7 V	1.7
V_IL	Low-level input voltage	V_CC = 0.8 V		0	V
		V_CC = 1.1 V to 1.95 V		0.35 × V_CC
		V_CC = 2.3 V to 2.7 V		0.7
V_I	Input voltage		0	3.6	V
V_O	Output voltage		0	V_CC	V
I_OH	High-level output current	V_CC = 0.8 V		–0.7	mA
		V_CC = 1.1 V		–3
		V_CC = 1.4 V		–5
		V_CC = 1.65 V		–8
		V_CC = 2.3 V		–9
I_OL	Low-level output current	V_CC = 0.8 V		0.7	mA
		V_CC = 1.1 V		3
		V_CC = 1.4 V		5
		V_CC = 1.65 V		8
		V_CC = 2.3 V		9
Δt/Δv	Input transition rise or fall rate			20	ns/V
T_A	Operating free-air temperature		–40	85	°C

(1) All unused inputs of the device must be held at V_CCor GND to ensure proper device operation. See Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AUC1G79			UNIT
		DBV (SOT-23)	DCK (SC70)	YZP (DSBGA)
		5 PINS	5 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	206	252	132	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS		V_CC	MIN	TYP⁽¹⁾	MAX	UNIT
V_OH		I_OH = –100 µA		0.8 V to 2.7 V	V_CC – 0.1			V
		I_OH = –0.7 mA		0.8 V		0.55
		I_OH = –3 mA		1.1 V	0.8
		I_OH = –5 mA		1.4 V	1
		I_OH = –8 mA		1.65 V	1.2
		I_OH = –9 mA		2.3 V	1.8
V_OL		I_OL = 100 μA		0.8 V to 2.7 V			0.2	V
		I_OL = 0.7 mA		0.8 V		0.25
		I_OL = 3 mA		1.1 V			0.3
		I_OL = 5 mA		1.4 V			0.4
		I_OL = 8 mA		1.65 V			0.45
		I_OL = 9 mA		2.3 V			0.6
I_I	D or CLK input	V_I = V_CC or GND		0 to 2.7 V			±5	µA
I_off		V_I or V_O= 2.7 V		0			±10	µA
I_CC		V_I = V_CC or GND,	I_O = 0	0.8 V to 2.7 V			10	µA
C_i		V_I = V_CC or GND		2.5 V		2.5		µF

(1) All typical values are at T_A = 25°C.

6.6 Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)

		V_CC = 0.8 V	V_CC = 1.2 V ± 0.1 V		V_CC = 1.5 V ± 0.1 V		V_CC = 1.8 V ± 0.15 V		V_CC = 2.5 V ± 0.2 V		UNIT
		TYP	MIN	MAX	MIN	MAX	MIN	MAX	MIN	MAX	MHz
f_clock	Clock frequency	50		200		225		250		275	ns
t_w	Pulse duration, CLK high or low	4.6	1.7		1.7		1.7		1.7		ns
t_su	Setup time before CLK↑, data high or low	1.5	1.1		0.7		0.7		0.5		ns
t_h	Hold time, data after CLK↑	0	0		0		0		0.1		ns

6.7 Switching Characteristics: C_L = 15 pF

over recommended operating free-air temperature range, C_L = 15 pF (unless otherwise noted) (see Figure 1)

PARAMETER	FROM (INPUT)	TO (OUTPUT)	V_CC = 0.8 V	V_CC = 1.2 V ± 0.1 V		V_CC = 1.5 V ± 0.1 V		V_CC = 1.8 V ± 0.15 V			V_CC = 2.5 V ± 0.2 V		UNIT
PARAMETER	FROM (INPUT)	TO (OUTPUT)	TYP	MIN	MAX	MIN	MAX	MIN	TYP	MAX	MIN	MAX	UNIT
f_max			50	200		225		250			275		MHz
t_pd	CLK	Q	5	1	3.9	0.8	2.5	0.3	1	1.9	0.3	1.3	ns

6.8 Switching Characteristics: C_L = 30 pF

over recommended operating free-air temperature range, C_L = 30 pF (unless otherwise noted) (see Figure 1)

PARAMETER	FROM (INPUT)	TO (OUTPUT)	V_CC = 1.8 V ± 0.15 V			V_CC = 2.5 V ± 0.2 V		UNIT
PARAMETER	FROM (INPUT)	TO (OUTPUT)	MIN	TYP	MAX	MIN	MAX	UNIT
f_max			250			275		ns
t_pd	CLK	Q	0.8	1.5	2.4	0.6	1.8	ns

6.9 Operating Characteristics

T_A= 25°C

PARAMETER		TEST CONDITIONS	V_CC = 0.8 V	V_CC = 1.2 V	V_CC = 1.5 V	V_CC = 1.8 V	V_CC = 2.5 V	UNIT
PARAMETER		TEST CONDITIONS	TYP	TYP	TYP	TYP	TYP	UNIT
C_pd	Power dissipation capacitance	f = 10 MHz	18	18	18	18.5	20.5	pF