SCES604J SEPTEMBER   2004  – December 2016 SN74AUP1G00

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 5 pF
    7. 6.7  Switching Characteristics, CL = 10 pF
    8. 6.8  Switching Characteristics, CL = 15 pF
    9. 6.9  Switching Characteristics, CL = 30 pF
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delays, Setup and Hold Times, and Pulse Width
    2. 7.2 Enable and Disable Times
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • YFP|6
  • DRL|5
  • DRY|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC Supply voltage –0.5 4.6 V
VI Input voltage (2) –0.5 4.6 V
VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 4.6 V
VO Output voltage range in the high or low state(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 50 mA
IOK Output clamp current VO < 0 50 mA
IO Continuous output current 20 mA
Continuous current through VCC or GND 50 mA
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 0.8 3.6 V
VIH High-level input voltage VCC = 0.8 V VCC V
VCC = 1.1 V to 1.95 V 0.65 × VCC
VCC = 2.3 V to 2.7 V 1.6
VCC = 3 V to 3.6 V 2
VIL Low-level input voltage VCC = 0.8 V 0 V
VCC = 1.1 V to 1.95 V 0.35 × VCC
VCC = 2.3 V to 2.7 V 0.7
VCC = 3 V to 3.6 V 0.9
VI Input voltage 0 3.6 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 0.8 V –20 µA
VCC = 1.1 V –1.1 mA
VCC = 1.4 V –1.7
VCC = 1.65 –1.9
VCC = 2.3 V –3.1
VCC = 3 V –4
IOL Low-level output current VCC = 0.8 V 20 µA
VCC = 1.1 V 1.1 mA
VCC = 1.4 V 1.7
VCC = 1.65 V 1.9
VCC = 2.3 V 3.1
VCC = 3 V 4
Δt/Δv Input transition rise or fall rate VCC = 0.8 V to 3.6 V 200 ns/V
TA Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

THERMAL METRIC(1) SN74AUP1G00 UNIT
DBV
(SOT-23)		 DCK
(SC70)		 DPW
(X2SON)		 DRL
(SOT)		 DRY
(SON)		 DSF
(SON)
5 PINS 5 PINS 5 PINS 5 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 298.6 314.4 291.8 349.7 554.9 407.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 240.2 128.7 224.2 120.5 385.4 232.0 °C/W
RθJB Junction-to-board thermal resistance 134.6 100.6 245.8 171.4 388.2 306.9 °C/W
ψJT Junction-to-top characterization parameter 114.5 7.1 31.4 10.8 159.0 40.3 °C/W
ψJB Junction-to-board characterization parameter 133.9 99.8 245.6 169.4 384.1 306.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a 195.4 n/a n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TA = 25°C TA = –40°C to +85°C UNIT
MIN TYP MAX MIN MAX
VOH IOH = –20 µA 0.8 V to 3.6 V VCC – 0.1 VCC – 0.1 V
IOH = –1.1 mA 1.1 V 0.75 × VCC 0.7 × VCC
IOH = –1.7 mA 1.4 V 1.11 1.03
IOH = –1.9 mA 1.65 V 1.32 1.3
IOH = –2.3 mA 2.3 V 2.05 1.97
IOH = –3.1 mA 1.9 1.85
IOH = –2.7 mA 3 V 2.72 2.67
IOH = –4 mA 2.6 2.55
VOL IOL = 20 µA 0.8 V to 3.6 V 0.1 0.1 V
IOL = 1.1 mA 1.1 V 0.3 × VCC 0.3 × VCC
IOL = 1.7 mA 1.4 V 0.31 0.37
IOL = 1.9 mA 1.65 V 0.31 0.35
IOL = 2.3 mA 2.3 V 0.31 0.33
IOL = 3.1 mA 0.44 0.45
IOL = 2.7 mA 3 V 0.31 0.33
IOL = 4 mA 0.44 0.45
II A or
B input		 VI = GND to 3.6 V 0 V to 3.6 V 0.1 0.5 µA
Ioff VI or VO = 0 V to 3.6 V 0 V 0.2 0.6 µA
ΔIoff VI or VO = 0 V to 3.6 V 0 V to 0.2 V 0.2 0.6 µA
ICC VI = GND or (VCC to 3.6 V),
IO = 0		 0.8 V to 3.6 V 0.5 0.9 µA
ΔICC VI = VCC – 0.6 V(1), IO = 0 3.3 V 40 50 µA
Ci VI = VCC or GND 0 V 1.5 pF
3.6 V 1.5
Co VO = GND 0 V 3 pF
(1) One input at VCC – 0.6 V, other input at VCC or GND.

6.6 Switching Characteristics, CL = 5 pF

over recommended operating free-air temperature range, (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC TA = 25°C TA = –40°C to +85°C UNIT
MIN TYP MAX MIN MAX
tpd A or B Y 0.8 V 16.6 ns
1.2 V ± 0.1 V 2.6 7 13.8 2.1 17.1
1.5 V ± 0.1 V 2.9 5 9.2 2.9 11.1
1.8 V ± 0.15 V 2 4 7.1 2 9
2.5 V ± 0.2 V 1.3 2.9 4.9 1.3 6.2
3.3 V ± 0.3 V 1 2.4 3.8 1 4.8

6.7 Switching Characteristics, CL = 10 pF

over recommended operating free-air temperature range, (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC TA = 25°C TA = –40°C to +85°C UNIT
MIN TYP MAX MIN MAX
tpd A or B Y 0.8 V 18.9 ns
1.2 V ± 0.1 V 3.2 8 15.7 3.1 18.8
1.5 V ± 0.1 V 2.9 5.8 10.5 2.9 12.1
1.8 V ± 0.15 V 2 4.7 8.2 2 9.8
2.5 V ± 0.2 V 1.3 3.4 5.7 1.3 6.8
3.3 V ± 0.3 V 1 2.9 4.5 1 5.2

6.8 Switching Characteristics, CL = 15 pF

over recommended operating free-air temperature range, (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC TA = 25°C TA = –40°C to +85°C UNIT
MIN TYP MAX MIN MAX
tpd A or B Y 0.8 V 21.3 ns
1.2 V ± 0.1 V 3.6 9 17.3 3.1 21.5
1.5 V ± 0.1 V 2.9 6.5 11.6 2.9 14
1.8 V ± 0.15 V 2 5.3 9.2 2 11.4
2.5 V ± 0.2 V 1.3 3.9 6.4 1.3 8
3.3 V ± 0.3 V 1 3.3 5.1 1 6.4

6.9 Switching Characteristics, CL = 30 pF

over recommended operating free-air temperature range, (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC TA = 25°C TA = –40°C to +85°C UNIT
MIN TYP MAX MIN MAX
tpd A or B Y 0.8 V 28.4 ns
1.2 V ± 0.1 V 4.9 11.9 21.9 4.4 27.1
1.5 V ± 0.1 V 2.9 8.6 14.7 2.9 17.7
1.8 V ± 0.15 V 2 7.1 11.5 2 14.2
2.5 V ± 0.2 V 1.3 5.3 8.1 1.3 10
3.3 V ± 0.3 V 1 4.5 6.5 1 8

6.10 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS VCC TYP UNIT
Cpd Power dissipation capacitance f = 10 MHz 0.8 V 4 pF
1.2 V ± 0.1 V 4
1.5 V ± 0.1 V 4
1.8 V ± 0.15 V 4
2.5 V ± 0.2 V 4
3.3 V ± 0.3 V 4

6.11 Typical Characteristics

SN74AUP1G00 D001_SCES604.gif Figure 1. TDP vs VCC
SN74AUP1G00 D002_SCES604.gif Figure 2. TPD vs Temperature
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