ZHCSKB1K June   2004  – May 2020 SN74AUP1G32

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 5 pF
    7. 6.7  Switching Characteristics, CL = 10 pF
    8. 6.8  Switching Characteristics, CL = 15 pF
    9. 6.9  Switching Characteristics, CL = 30 pF
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delays, Setup and Hold Times, and Pulse Width
    2. 7.2 Enable and Disable Times
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)DBVDCKDRLDSFDRYDPWUNIT
5 PINS5 PINS5 PINS6 PINS6 PINS5 PINS
RθJAJunction-to-ambient thermal resistance (standard data sheet value)271.4338.4349.7407.1554.9492.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance (standard data sheet value)213.5110.6120.5232.0385.4232.6°C/W
RθJBJunction-to-board thermal resistance (standard data sheet value)108.2118.8171.4306.9388.2355.4°C/W
ψJTJunction-to-top characterization parameter (standard data sheet value)89.33.010.840.3159.037.4°C/W
ψJBJunction-to-board characterization parameter (standard data sheet value)107.6117.8169.4306.0384.1353.9°C/W
ψJC(bot)Junction-to-case (bottom) thermal resistance (standard data sheet value)–––––147.9°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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