SCES603K August   2004  – October 2014 SN74AUP1G34

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplifed Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Function
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Handling Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics, CL = 5 pF
    7. 7.7  Switching Characteristics, CL = 10 pF
    8. 7.8  Switching Characteristics, CL = 15 pF
    9. 7.9  Switching Characteristics, CL = 30 pF
    10. 7.10 Operating Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Propagation Delays, Setup and Hold Times, and Pulse Width
    2. 8.2 Enable and Disable Times
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

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7 Specifications

7.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage range –0.5 4.6 V
VI Input voltage range(2) –0.5 4.6 V
VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 4.6 V
VO Output voltage range in the high or low state(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±20 mA
Continuous current through VCC or GND ±50 mA
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 0 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 0 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions(2)

MIN MAX UNIT
VCC Supply voltage 0.8 3.6 V
VIH High-level input voltage VCC = 0.8 V VCC V
VCC = 1.1 V to 1.95 V 0.65 × VCC
VCC = 2.3 V to 2.7 V 1.6
VCC = 3 V to 3.6 V 2
VIL Low-level input voltage VCC = 0.8 V 0 V
VCC = 1.1 V to 1.95 V 0.35 × VCC
VCC = 2.3 V to 2.7 V 0.7
VCC = 3 V to 3.6 V 0.9
VI Input voltage 0 3.6 V
VO Output voltage 0 VCC V
IOH(1) High-level output current VCC = 0.8 V –20 µA
VCC = 1.1 V –1.1 mA
VCC = 1.4 V –1.7
VCC = 1.65 V –1.9
VCC = 2.3 V –3.1
VCC = 3 V -4
IOL(1) Low-level output current VCC = 0.8 V 20 µA
VCC = 1.1 V 1.1 mA
VCC = 1.4 V 1.7
VCC = 1.65 V 1.9
VCC = 2.3 V 3.1
VCC = 3 V 4
Δt/Δv Input transition rise or fall rate VCC = 0.8 V to 3.6 V 200 ns/V
TA Operating free-air temperature –40 85 °C
(1) Defined by the signal integrity requirements and design goal priorities
(2) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

7.4 Thermal Information

THERMAL METRIC(1) DBV DCK DRL DSF DRY UNIT
5 PINS 5 PINS 5 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 271.4 338.4 349.7 407.1 554.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 213.5 110.6 120.5 232.0 385.4
RθJB Junction-to-board thermal resistance 108.2 118.8 171.4 306.9 388.2
ψJT Junction-to-top characterization parameter 89.3 3.0 10.8 40.3 159.0
ψJB Junction-to-board characterization parameter 107.6 117.8 169.4 306.0 384.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TA = 25°C TA = –40°C to 85°C UNIT
MIN TYP MAX MIN MAX
VOH IOH = –20 µA 0.8 V to 3.6 V VCC – 0.1 VCC – 0.1 V
IOH = –1.1 mA 1.1 V 0.75 × VCC 0.7 × VCC
IOH = –1.7 mA 1.4 V 1.11 1.03
IOH = –1.9 mA 1.65 V 1.32 1.3
IOH = –2.3 mA 2.3 V 2.05 1.97
IOH = –3.1 mA 1.9 1.85
IOH = –2.7 mA 3 V 2.72 2.67
IOH = –4 mA 2.6 2.55
VOL IOL = 20 µA 0.8 V to 3.6 V 0.1 0.1 V
IOL = 1.1 mA 1.1 V 0.3 × VCC 0.3 × VCC
IOL = 1.7 mA 1.4 V 0.31 0.37
IOL = 1.9 mA 1.65 V 0.31 0.35
IOL = 2.3 mA 2.3 V 0.31 0.33
IOL = 3.1 mA 0.44 0.45
IOL = 2.7 mA 3 V 0.31 0.33
IOL = 4 mA 0.44 0.45
II A input VI = GND to 3.6 V 0 V to 3.6 V 0.1 0.5 μA
Ioff VI or VO = 0 V to 3.6 V 0 V 0.2 0.6 μA
ΔIoff VI or VO = 0 V to 3.6 V 0 V to 0.2 V 0.2 0.6 μA
ICC VI = GND or
(VCC to 3.6 V)		 IO = 0 0.8 V to 3.6 V 0.5 0.9 μA
ΔICC VI = VCC – 0.6 V IO = 0 3.3 V 40 50 μA
Ci VI = VCC or GND 0 V 1.5 pF
3.6 V 1.5
Co VO = GND 0 V 2.5 pF

7.6 Switching Characteristics, CL = 5 pF

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC TA = 25°C TA = –40°C to 85°C UNIT
MIN TYP MAX MIN MAX
tpd A Y 0.8 V 1.8 14.5 27.4 ns
1.2 V ± 0.1 V 3 5.6 11.2 0.4 13.9
1.5 V ± 0.1 V 2.5 4 7.2 0.7 9.2
1.8 V ± 0.15 V 2.2 3.2 6 0.8 7.3
2.5 V ± 0.2 V 1.8 2.4 3.9 0.6 5.1
3.3 V ± 0.3 V 1.4 2 3.2 0.6 4.1

7.7 Switching Characteristics, CL = 10 pF

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3 and Figure 4
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC TA = 25°C TA = –40°C to 85°C UNIT
MIN TYP MAX MIN MAX
tpd A Y 0.8 V 2.7 16.6 28.2 ns
1.2 V ± 0.1 V 3.6 6.6 12.7 0.3 15.4
1.5 V ± 0.1 V 3 4.8 8.3 1.2 10.3
1.8 V ± 0.15 V 2.7 3.9 6.9 1.3 8.3
2.5 V ± 0.2 V 2.3 2.9 4.5 1.2 5.8
3.3 V ± 0.3 V 2 2.4 3.8 1.1 4.8

7.8 Switching Characteristics, CL = 15 pF

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3 and Figure 4
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC TA = 25°C TA = –40°C to 85°C UNIT
MIN TYP MAX MIN MAX
tpd A Y 0.8 V 5.1 18.6 30.2 ns
1.2 V ± 0.1 V 4.3 7.5 13.6 1.3 16.5
1.5 V ± 0.1 V 3.6 5.5 9 1.9 11.2
1.8 V ± 0.15 V 3.2 4.5 7.5 1.9 8.9
2.5 V ± 0.2 V 2.6 3.4 5.2 1.7 6.5
3.3 V ± 0.3 V 2.3 2.9 4.2 1.5 5

7.9 Switching Characteristics, CL = 30 pF

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3 and Figure 4
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC TA = 25°C TA = –40°C to 85°C UNIT
MIN TYP MAX MIN MAX
tpd A Y 0.8 V 9.9 24.2 36.3 ns
1.2 V ± 0.1 V 6.3 10.1 16.3 3.6 18.9
1.5 V ± 0.1 V 5.1 7.4 11 3.4 13
1.8 V ± 0.15 V 4.5 6.1 9.3 3.2 10.6
2.5 V ± 0.2 V 3.7 4.7 6.4 2.7 7.8
3.3 V ± 0.3 V 3.3 4 5.3 2.5 6.5

7.10 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS VCC TYP UNIT
Cpd Power dissipation capacitance f = 10 MHz 0.8 V 3.8 pF
1.2 V ± 0.1 V 3.8
1.5 V ± 0.1 V 3.8
1.8 V ± 0.15 V 3.8
2.5 V ± 0.2 V 3.9
3.3 V ± 0.3 V 4.1

7.11 Typical Characteristics

D001_SCES603.gifFigure 1. TPD vs VCC 15 pF Load
D002_SCES603.gifFigure 2. TPD vs Temperature 15 pF Load
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