4 Revision History
Changes from Revision D (February 2016) to Revision E (October 2021)
- Changed pinout images style and formatting, removed overlapping
letters in YZP package drawing, corrected BGA pin numbers in the Pin
Functions table, changed VCC and GND pin TYPE From: "—" To:
"P" in the Pin Functions table and added footnote to the Pin
Functions table to define pin typesGo
- Changed maximum output voltage in the low state in the
Section 6.1
table to 4.6 VGo
- Changed the VO Output voltage in the
Section 6.3
table from 'VCC' to '3.6'Go
- Updated RθJA values to more accurately reflect device
characteristics: YFP 132 to 125.4, DCK 252 to 302.4, DRY 234 to 338, DSF 300 to
372.5, added standard thermal characteristics for all packages
(RθJC(top), RθJB, ΨJT, ΨJB,
RθJC(bot))Go
Changes from Revision C (November 2014) to Revision D (February 2016)
- Changed the VCC pin TYPE From: "I" To: "—" in the Pin
Functions tableGo
- Added "Junction temperature" to the
Section 6.1
table Go
- Deleted the IOH High-level output current from the
Section 6.3
table Go
- Deleted VOH PARAMETER from the
Section 6.5
table, these specifications do not pertain to open drain devicesGo
Changes from Revision B (September 2009) to Revision C (November 2014)
- 删除了订购信息 表Go
- 添加了应用、器件信息 表、引脚功能 表、处理等级 表、热性能信息 表、典型特性、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
- 更新了特性 中的 Ioff
Go