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ZHCSMG6E September 2009 – October 2021 SN74AUP2G07

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

DRY|6
- MPDS221F
DSF|6
- MPDS301G
YFP|6
- MXBG056R
DCK|6
- MPDS114E

散热焊盘机械数据 (封装 | 引脚)

DRY|6
- QFND138E

订购信息

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage		0.8	3.6	V
V_IH	High-level input voltage	V_CC = 0.8 V	V_CC		V
		V_CC = 1.1 V to 1.95 V	0.65 × V_CC
		V_CC = 2.3 V to 2.7 V	1.6
		V_CC = 3 V to 3.6 V	2
V_IL	Low-level input voltage	V_CC = 0.8 V		0	V
		V_CC = 1.1 V to 1.95 V		0.35 × V_CC
		V_CC = 2.3 V to 2.7 V		0.7
		V_CC = 3 V to 3.6 V		0.9
V_I	Input voltage		0	3.6	V
V_O	Output voltage		0	3.6	V
I_OL	Low-level output current	V_CC = 0.8 V		20	μA
		V_CC = 1.1 V		1.1	mA
		V_CC = 1.4 V		1.7
		V_CC = 1.65 V		1.9
		V_CC = 2.3 V		3.1
		V_CC = 3 V		4
Δt/Δv	Input transition rise or fall rate	V_CC = 0.8 V to 3.6 V		200	ns/V
T_A	Operating free-air temperature		–40	85	°C

(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.