ZHCSLI2B June   2011  – July 2020 SN74AVC4T234

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCB = 1.1 V
    7. 6.7  Switching Characteristics, VCCB = 1.4 V
    8. 6.8  Switching Characteristics, VCCB = 1.65 V
    9. 6.9  Switching Characteristics, VCCB = 2.3 V
    10. 6.10 Switching Characteristics, VCCB = 3 V
    11. 6.11 Operating Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 0.9-V to 3.6-V Power-Supply Range
      2. 8.3.2 Supports High Speed Translation
      3. 8.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Support Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)SN74AVC4T234SN74AVC4T234UNIT
ZSU (uCSP)ZWA (NFBGA)
11 PINS11 PINS
RθJAJunction-to-ambient thermal resistance(2)165.9181.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance123.8136.7°C/W
RθJBJunction-to-board thermal resistance123.2137.7°C/W
ψJTJunction-to-top characterization parameter4.47.5°C/W
ψJBJunction-to-board characterization parameter122.9137.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-5.
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