ZHCSV08C November   2009  – February 2024 SN74AVC4T245-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: VCCA = 1.2V
    7. 5.7  Switching Characteristics, VCCA = 1.5V ± 0.1V
    8. 5.8  Switching Characteristics: VCCA = 1.8V ± 0.15V
    9. 5.9  Switching Characteristics: VCCA = 2.5V ± 0.2V
    10. 5.10 Switching Characteristics: VCCA = 3.3V ± 0.3V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design
      2. 7.3.2 Supports High Speed Translation
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
  • BQB|16
  • DYY|16
  • RGY|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) SN74AVC4T245-Q1 UNIT
RGY (VQFN)

PW (TSSOP)

BQB (WQFN)

DYY (SOT)
16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 37.5

101.8

80.8

163.4

 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.5

37.2

77.9

90.0

 °C/W
RθJB Junction-to-board thermal resistance 15.6

60.6

50.7

93.1

 °C/W
ψJT Junction-to-top characterization parameter 0.5

1.6

7.4

10.9

 °C/W
ψJB Junction-to-board characterization parameter 15.8

60.0

50.6

92.1

 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.5

N/A

28.4

N/A

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
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