ZHCSTK4H June 2004 – March 2024 SN74AVC4T245
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
THERMAL METRIC(1) | SN74AVC4T245 | UNIT | |||||||
---|---|---|---|---|---|---|---|---|---|
D |
BQB |
DYY |
DGV | PW | RGY | RSV | |||
16 PINS | |||||||||
RθJA | Junction-to-ambient thermal resistance | 85.5 |
80.8 |
163.4 |
126.0 | 101.8 | 37.5 | 146.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 46.9 |
77.9 |
90.0 |
50.8 | 37.2 | 54.5 | 53.6 | |
RθJB | Junction-to-board thermal resistance | 43.0 |
50.7 |
93.1 |
57.7 | 60.6 | 15.6 | 75.6 | |
ψJT | Junction-to-top characterization parameter | 13.4 |
7.4 |
10.9 |
5.7 | 1.6 | 0.5 | 13.5 | |
ψJB | Junction-to-board characterization parameter | 42.7 |
50.6 |
92.1 |
57.2 | 60.0 | 15.8 | 75.6 | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — |
28.4 |
— |
— | — | 3.5 | — |