ZHCSMK1H February   2008  – March 2024 SN74AVC4T774

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: VCCA = 1.2 V ± 0.1 V
    7. 5.7  Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    8. 5.8  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    9. 5.9  Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    10. 5.10 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.1V to 3.6V Power-Supply Range
      2. 7.3.2 Support High-Speed Translation
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) SN74AVC4T774 UNIT
RGY (VQFN) RSV (UQFN) DYY (SOT) BQB (WQFN) PW (TSSOP)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 37.7 139.2 163.4 79.1 123.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.1 64.9 90.0 77.5 58.3 °C/W
RθJB Junction-to-board thermal resistance 15.9 67.7 93.1 49.0 81.7 °C/W
YJT Junction-to-top characterization parameter 0.5 1.7 10.9 7.3 6.7 °C/W
YJB Junction-to-board characterization parameter 16.1 67.4 92.1 48.9 80.9 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A N/A N/A 26.4 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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