米6体育平台手机版

ZHCSLR0C August 2004 – August 2020 SN74AVCH24T245

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AVCH24T245			UNIT
		GRG	ZRG	NMU
		83	83	83
R _θJA	Junction-to-ambient thermal resistance	38.1	38.1	44.3	°C/W
R _θJC(top)	Junction-to-case (top) thermal resistance	22.8	22.8	24.5	°C/W
R _θJB	Junction-to-board thermal resistance	17.0	17.0	29.1	°C/W
ψ _JT	Junction-to-top characterization parameter	0.44	0.44	0.5	°C/W
ψ _JB	Junction-to-board characterization parameter	16.9	16.9	29.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.