SCES582H July   2004  – April 2015 SN74AVCH2T45

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: VCCA = 1.2 V
    7. 7.7  Switching Characteristics: VCCA = 1.5 V
    8. 7.8  Switching Characteristics: VCCA = 1.8 V
    9. 7.9  Switching Characteristics: VCCA = 2.5 V
    10. 7.10 Switching Characteristics: VCCA = 3.3 V
    11. 7.11 Operating Characteristics
    12. 7.12 Typical Characteristics
      1. 7.12.1 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 1.8 V
      2. 7.12.2 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 2.5 V
      3. 7.12.3 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 3.3 V
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 VCC Isolation
      2. 9.3.2 2-Rail Design
      3. 9.3.3 IO Ports are 4.6 V Tolerant
      4. 9.3.4 Partial Power Down Mode
      5. 9.3.5 Bus Hold on Data Inputs
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Unidirectional Logic Level-Shifting Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Bidirectional Logic Level-Shifting Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Enable Times
        3. 10.2.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCU|8
  • YZP|8
  • DCT|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Description (Continued)

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The VCC isolation feature ensures that if either VCC input is at GND, then both outputs are in the high-impedance state. The bus-hold circuitry on the powered-up side always stays active.

Active bus-hold circuitry holds unused or un-driven inputs at a valid logic state. NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
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