ZHCSTS8J April   2004  – April 2024 SN74AVCH8T245

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2V
    7. 5.7  Switching Characteristics, VCCA= 1.5V ± 0.1V
    8. 5.8  Switching Characteristics, VCCA= 1.8V ± 0.15V
    9. 5.9  Switching Characteristics, VCCA= 2.5V ± 0.2V
    10. 5.10 Switching Characteristics, VCCA= 3.3V ± 0.3V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design
      2. 7.3.2 Supports High-Speed Translation
      3. 7.3.3 Partial-Power-Down Mode Operation
      4. 7.3.4 Bus-Hold Circuitry
      5. 7.3.5 VCC Isolation Feature
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGV|24
  • RHL|24
  • PW|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) SN74AVCH8T245 UNIT
DGV (TVSOP) PW (TSSOP) RHL (VQFN)
24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance(4) 116.7 93.1 36.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.5

36.7

 32.5 °C/W
RθJB Junction-to-board thermal resistance 62.1

48.4

 15.7 °C/W
ψJT Junction-to-top characterization parameter 7.0 93.1 0.7 °C/W
ψJB Junction-to-board characterization parameter 61.6 48.0 15.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 5.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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