ZHCSIL3A August   2018  – January 2019 SN74AXCH8T245

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     典型应用原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA = 0.7 V
    7. 6.7  Switching Characteristics, VCCA = 0.8 V
    8. 6.8  Switching Characteristics, VCCA = 0.9 V
    9. 6.9  Switching Characteristics, VCCA = 1.2 V
    10. 6.10 Switching Characteristics, VCCA = 1.5 V
    11. 6.11 Switching Characteristics, VCCA = 1.8 V
    12. 6.12 Switching Characteristics, VCCA = 2.5 V
    13. 6.13 Switching Characteristics, VCCA = 3.3 V
    14. 6.14 Operating Characteristics: TA = 25°C
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Up-Translation and Down-Translation From 0.65 V to 3.6 V
      2. 8.3.2 Multiple Direction Control Pins
      3. 8.3.3 Bus-Hold Circuitry
      4. 8.3.4 Ioff Supports Partial-Power-Down Mode Operation
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power Supply Recommendations

Always apply a ground reference to the GND pins first. However, there are no additional requirements for power supply sequencing.

This device was designed with various power supply sequencing methods in mind to help prevent unintended triggering of downstream devices. For more information regarding the power up glitch performance of the AXC family of level translators, see the Power Sequencing for AXC Family of Devices application report.