米6体育平台手机版

ZHCSLO1D September 1988 – February 2021 SN74BCT374

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74BCT374				UNIT
		DB (SSOP)	DW (SOIC)	N (PDIP)	NS (SO)
		20 PINS	20 PINS	20 PINS	20 PINS
R _θJA	Junction-to-ambient thermal resistance	84.4	73.4	59.7	71.2	°C/W
R _θJB	Junction-to-board thermal resistance	40.1	41.9	40.6	36.2	°C/W
ψ _JT	Junction-to-top characterization parameter	6.2	14.6	24.9	7.6	°C/W
ψ _JB	Junction-to-board characterization parameter	39.5	41.4	40.3	35.9	°C/W
R _θJC(top)	Junction-to-case (top) thermal resistance	36.8	38.8	50.0	34.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.