ZHCSIF2C October 2003 – June 2018 SN74CB3Q3253
PRODUCTION DATA.
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | SN74CB3Q3253 | UNIT | ||||
|---|---|---|---|---|---|---|
| DBQ
(SSOP) |
DGV
(TVSOP) |
PW
(TSSOP) |
RGY
(VQFN) |
|||
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 114.3 | 126 | 112.7 | 45.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 65.4 | 51.3 | 47.5 | 59.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 56.8 | 57.8 | 57.85 | 23.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 18.3 | 5.9 | 6 | 2.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 56.4 | 57.3 | 57.3 | 23.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | 11.5 | °C/W |