ZHCSIG9D September 2003 – July 2018 SN74CB3Q3257
PRODUCTION DATA.
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | SN74CB3Q3257 | UNIT | ||||
|---|---|---|---|---|---|---|
| DBQ (SSOP) | DGV (TVSOP) | PW (TSSOP) | RGY (VQFN) | |||
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 114.3 | 126.0 | 112.7 | 49.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 65.4 | 51.3 | 47.5 | 61.2 | |
| RθJB | Junction-to-board thermal resistance | 56.8 | 57.8 | 57.8 | 25.9 | |
| ψJT | Junction-to-top characterization parameter | 18.3 | 5.9 | 6.0 | 2.3 | |
| ψJB | Junction-to-board characterization parameter | 56.4 | 57.3 | 57.3 | 26.0 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | - | 11.4 | |