ZHCSJ81C February 2003 – December 2018 SN74CB3T3125
PRODUCTION DATA.
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | SN74CB3T3125 | UNIT | |||
|---|---|---|---|---|---|
| VQFN (RGY) | TSSOP (PW) | TVSOP (DGV) | |||
| 14 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 55.5 | 123.3 | 154.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 56.9 | 53.0 | 64.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 30.9 | 66.3 | 88.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.6 | 9.1 | 10.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 30.9 | 65.7 | 87.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 14.6 | - | - | °C/W |