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SCDS001O November 1992 – September 2015 SN74CBT3244

PRODUCTION DATA.

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请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

DGV|20
DB|20
DW|20
PW|20
RGY|20

散热焊盘机械数据 (封装 | 引脚)

订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
Supply voltage, V_CC	–0.5	7	V
Input voltage, V_I ⁽²⁾	–0.5	7	V
Continuous channel current		128	mA
Clamp current, I_K (V_I/O < 0)		–50	mA
Storage temperature, T_stg	–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(3) The package thermal impedance is calculated in accordance with JESD 51-7.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±1500	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
V_CC	Supply voltage	4.5	5.5	V
V_IH	High-level control input voltage	2		V
V_IL	Low-level control input voltage		0.8	V
T_A	Operating free-air temperature	–40	85	°C

(1) All unused control inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information Package

THERMAL METRIC⁽¹⁾⁽³⁾		SN74CBT3244					UNIT
		DB (SSOP)	DBQ (SSOP)	DGV (TVSOP)	PW (TSSOP)	RGY (VQFN)
		20 PINS	20 PINS	20 PINS	20 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	70	68	92	83	37	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS			TYP⁽¹⁾	MAX	UNIT
V_IK		V_CC = 4.5 V	I_I = –18 mA			–1.2	V
I_I		V_CC = 5.5 V	V_I = 5.5 V or GND			±5	µA
I_CC		V_CC = 5.5 V	I_O = 0,	V_I = V_CC or GND		50	µA
ΔI_CC⁽²⁾	Control inputs	V_CC = 5.5 V	One input at 3.4 V,	Other inputs at V_CC or GND		3.5	mA
C_i	Control inputs	V_I = 3 V or 0			3		pF
C_io(OFF)		V_O = 3 V or 0	OE = V_CC		6		pF
r_on⁽³⁾		V_CC = 4.5 V	V_I = 0 V	I_I = 64 mA	5	7	Ω
			V_I = 0 V	I_I = 30 mA	5	7
			V_I = 2.4 V	I_I = 15 mA	10	15

(1) All typical values are at V_CC = 5 V, T_A = 25°C.

(2) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V_CC or GND.

(3) Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined by the lowest voltage of the two (A or B) terminals.

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER	FROM (INPUT)	TO (OUTPUT)	MIN	MAX	UNIT
t_pd⁽¹⁾	A or B	B or A		0.25	ns
t_en	OE	A or B	1	8.9	ns
t_dis	OE	A or B	1	7.4	ns

(1) This propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).

6.7 Typical Characteristics

Note device variation mentioned in Electrical Characteristics

Figure 1. I_CC variation With Temperature