SCDS019M May 1995 – December 2015 SN74CBT3251
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
- PW|16
- DB|16
- DBQ|16
- RGY|16
- D|16
散热焊盘机械数据 (封装 | 引脚)
- RGY|16
订购信息
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply voltage, VCC | –0.5 | 7 | V | |
| Input voltage, VI(2) | –0.5 | 7 | V | |
| Continuous channel current | 128 | mA | ||
| Input clamp current, IK (VI/O < 0) | –50 | mA | ||
| Maximum junction temperature, TJ | 150 | °C | ||
| Storage temperature, Tstg | –65 | 150 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±1500 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VCC | Supply voltage | 4 | 5.5 | V |
| VIH | High-level control input voltage | 2 | V | |
| VIL | Low-level control input voltage | 0.8 | V | |
| TA | Operating free-air temperature | –40 | 85 | °C |
6.4 Thermal Information
| THERMAL METRIC(1) | SN74CBT3251 | UNIT | |||||
|---|---|---|---|---|---|---|---|
| D (SOIC) |
DB (SSOP) |
DBQ (SSOP) |
PW (TSSOP) |
RGY (VQFN) |
|||
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 73(2) | 82(2) | 90(2) | 108(2) | 39(3) | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 70.6 | 49.0 | 59.0 | 41.6 | 52.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 77.8 | 49.4 | 50.1 | 51.9 | 20.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 24.3 | 10.5 | 13.9 | 4.0 | 1.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 77.4 | 48.8 | 49.7 | 51.3 | 20.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | — | — | 6.4 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
(3) The package thermal impedance is calculated in accordance with JESD 51-5.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP(1) | MAX | UNIT | |||
|---|---|---|---|---|---|---|---|---|
| VIK | VCC = 4.5 V, II = −18 mA | –1.2 | V | |||||
| II | VCC = 5.5 V, VI = 5.5 V or GND | ±1 | µA | |||||
| ICC | VCC = 5.5 V, IO = 0, VI = VCC or GND | 3 | µA | |||||
| ΔICC(2) | Control inputs | VCC = 5.5 V; One input at 3.4 V, other inputs at VCC or GND | 2.5 | mA | ||||
| Ci | Control inputs | VI = 3 V or 0 | 3.5 | pF | ||||
| Cio(OFF) | A port | VO = 3 V or 0, OE = VCC | 17.5 | pF | ||||
| B port | VO = 3 V or 0, OE = VCC | 4 | ||||||
| ron(3) | VCC = 4 V, TYP at VCC = 4 V, VI = 2.4 V, II = 15 mA | 14 | 20 | Ω | ||||
| VCC = 4.5 V | VI = 0 | II = 64 mA | 5 | 7 | ||||
| II = 30 mA | 5 | 7 | ||||||
| VI = 2.4 V, II = 15 mA | 10 | 15 | ||||||
(1) All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
(2) This is the increase in supply current for each input at the specified TTL voltage level, rather than VCC or GND.
(3) Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals.
6.6 Switching Characteristics
over operating free-air temperature free-air temperature range, CL = 50 pF (unless otherwise noted)| PARAMETER | FROM (INPUT) | TO (OUTPUT) | VCC | MIN | MAX | UNIT |
|---|---|---|---|---|---|---|
| tpd(1) | A or B | B or A | VCC = 4 V | 0.35 | ns | |
| VCC = 5 V ±0.5 V | 0.24 | |||||
| tpd | S | A | VCC = 4 V | 6 | ns | |
| VCC = 5 V ±0.5 V | 2 | 5.5 | ||||
| ten | S | B | VCC = 4 V | 6.4 | ns | |
| VCC = 5 V ±0.5 V | 1.5 | 5.6 | ||||
| OE | A or B | VCC = 4 V | 6.4 | |||
| VCC = 5 V ±0.5 V | 1.6 | 5.8 | ||||
| tdis | S | B | VCC = 4 V | 6.8 | ns | |
| VCC = 5 V ±0.5 V | 1.9 | 6.4 | ||||
| OE | A or B | VCC = 4 V | 6 | |||
| VCC = 5 V ±0.5 V | 2.3 | 6.2 |
(1) The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
6.7 Typical Characteristic
Figure 1. ICC Variation With Temperature