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ZHCSJ99L December 1997 – August 2022 SN74CBTLV3126

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74CBTLV3126					UNIT
		D (SOIC)	DGV (TVSOP)	PW (TSSOP)	RGY (VQFN)	DBQ (SSOP)
		14 PINS	14 PINS	14 PINS	14 PINS	16 Pins
R_θJA	Junction-to-ambient thermal resistance	100.6	154.8	123.3	59.6	118.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	55.5	64.5	53.0	71.3	66.4	°C/W
R_θJB	Junction-to-board thermal resistance	56.8	88.4	66.3	35.6	62.2	°C/W
Ψ_JT	Junction-to-top characterization parameter	17.0	11.1	9.3	4.2	20.9	°C/W
Ψ_JB	Junction-to-board characterization parameter	56.4	87.4	65.7	35.7	61.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	16.1	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.