ZHCSHG4J December 1997 – January 2018 SN74CBTLV3253
PRODUCTION DATA.
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | SN74CBTLV3253 | UNIT | |||||
|---|---|---|---|---|---|---|---|
| D
(SOIC) |
DBQ (SSOP) | DGV (TVSOP) | PW (TSSOP) | RGY
(VQFN) |
|||
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 86.7 | 112.4 | 123.1 | 110.9 | 47.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.8 | 63.6 | 48.7 | 45.8 | 58.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 43.7 | 54.8 | 54.9 | 56.0 | 24.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 12.3 | 17.0 | 5.2 | 5.4 | 1.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 43.5 | 54.4 | 54.3 | 55.4 | 24.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | n/a | 9.6 | °C/W |