ZHCSJ64H March 1998 – December 2018 SN74CBTLV3383
PRODUCTION DATA.
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | SN74CBTLV3383 | UNIT | ||||
|---|---|---|---|---|---|---|
| DBQ
(QSOP) |
DVG
(TVSOP) |
DW
(SPIC) |
PW
(TSSOP) |
|||
| 24 PINS | 24 PINS | 24 PINS | 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 86.6 | 105.6 | 66.6 | 90.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 40.5 | 36.9 | 36.7 | 34.12 | °C/W |
| RθJB | Junction-to-board thermal resistance | 40.8 | 51.1 | 36.6 | 45.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7.8 | 2.6 | 13.1 | 2.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 40.4 | 50.6 | 36.4 | 44.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | n/a | °C/W |