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ZHCSRK3F March 1984 – April 2021 SN54HC03 , SN74HC03

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HC03				UNIT
		D (SOIC)	N (PDIP)	NS (SOP)	PW (TSSOP)
		14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	133.6	66.0	122.6	151.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	89	53.7	81.8	79.4	°C/W
R_θJB	Junction-to-board thermal resistance	89.5	45.7	83.8	94.7	°C/W
Ψ_JT	Junction-to-top characterization parameter	45.5	33.3	45.4	25.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	89.1	45.5	83.4	94.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.