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ZHCSRL5H December 1982 – April 2021 SN54HC04 , SN74HC04

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HC04					UNIT
		D (SOIC)	DB (SSOP)	N (PDIP)	NS (SOP)	PW (TSSOP)
		14 PINS	14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	133.6	114.8	60.7	122.6	151.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	89	64.5	47.8	81.8	79.4	°C/W
R_θJB	Junction-to-board thermal resistance	89.5	65.1	40.6	83.8	94.7	°C/W
Ψ_JT	Junction-to-top characterization parameter	45.5	23.7	26.9	45.4	25.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	89.1	64.4	40.3	83.4	94.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.