米6体育平台手机版

ZHCSOK8F March 1984 – April 2021 SN54HC126 , SN74HC126

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HC126					UNIT
		D (SOIC)	DB (SSOP)	N (PDIP)	NS (SO)	PW (TSSOP)
		14 PINS	14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	133.6	108.0	62.5	122.6	151.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	89	57.8	50.2	81.8	79.4	°C/W
R_θJB	Junction-to-board thermal resistance	89.5	58.3	42.2	83.8	94.7	°C/W
Ψ_JT	Junction-to-top characterization parameter	45.5	18.0	29.8	45.4	25.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	89.1	57.6	42.0	83.4	94.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.