米6体育平台手机版

SCLS087F December 1982 – June 2021 SN54HC21 , SN74HC21

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HC21				UNIT
		N (PDIP)	D (SOIC)	PW (TSSOP)	NS (SOP)
		14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	65.2	133.6	151.7	122.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	44.9	89.0	79.4	81.8	°C/W
R_θJB	Junction-to-board thermal resistance	52.9	89.5	94.7	83.8	°C/W
Ψ_JT	Junction-to-top characterization parameter	32.5	45.5	25.2	45.4	°C/W
Ψ_JB	Junction-to-board characterization parameter	44.7	89.1	94.1	83.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.