米6体育平台手机版

ZHCSPW9C September 2002 – June 2022 SN74HC244-Q1

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC		DW (SOIC)	PW (TSSOP)	UNIT
THERMAL METRIC		20 PINS	20 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	109.1	131.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	76	72.2	°C/W
R_θJB	Junction-to-board thermal resistance	77.6	82.8	°C/W
ψ_JT	Junction-to-top characterization parameter	51.5	21.5	°C/W
ψ_JB	Junction-to-board characterization parameter	77.1	82.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.