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ZHCSNX6G December 1982 – April 2021 SN74HC266

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HC266			UNIT
		N (PDIP)	D (SOIC)	NS (SOP)
		14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	62.5	133.6	122.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	42.4	89.0	81.8	°C/W
R_θJB	Junction-to-board thermal resistance	50.2	89.5	83.8	°C/W
Ψ_JT	Junction-to-top characterization parameter	29.8	45.5	45.4	°C/W
Ψ_JB	Junction-to-board characterization parameter	42.0	89.1	83.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.