ZHCSQH0F December 1982 – April 2022 SN54HC273 , SN74HC273
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC | SN74HC273 | UNIT | |||||
|---|---|---|---|---|---|---|---|
| DW (SOIC) | DB (SSOP) | N (PDIP) | NS (SO) | PW (TSSOP) | |||
| 20 PINS | 20 PINS | 20 PINS | 20 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(1) | 109.1 | 122.7 | 84.6 | 113.4 | 131.8 | °C/W |
| RθJC (top) | Junction-to-case (top) thermal resistance | 76 | 81.6 | 72.5 | 78.6 | 72.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 77.6 | 77.5 | 65.3 | 78.4 | 82.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 51.5 | 46.1 | 55.3 | 47.1 | 21.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 77.1 | 77.1 | 65.2 | 78.1 | 82.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | N/A | °C/W |