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ZHCSNX7F December 1982 – April 2021 SN54HC32 , SN74HC32

PRODUCTION DATA

6.5 Thermal Information - 54

THERMAL METRIC⁽¹⁾		SN54HC32			UNIT
		J (CDIP)	W (CFP)	FK (LCCC)
		14 PINS	14 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	—	—	—	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	54.9	88.3	61.0	°C/W
R_θJB	Junction-to-board thermal resistance	80.1	156.0	59.6	°C/W
Ψ_JT	Junction-to-top characterization parameter	—	—	—	°C/W
Ψ_JB	Junction-to-board characterization parameter	—	—	—	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	25.1	15.2	11.7	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.