ZHCSNX7F December   1982  – April 2021 SN54HC32 , SN74HC32

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information - 74
    5. 6.5  Thermal Information - 54
    6. 6.6  Electrical Characteristics - 74
    7. 6.7  Electrical Characteristics - 54
    8. 6.8  Switching Characteristics - 74
    9. 6.9  Switching Characteristics - 54
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
      1.      Application and Implementation
        1. 9.1 Application Information
        2. 9.2 Typical Application
          1. 9.2.1 Design Requirements
            1. 9.2.1.1 Power Considerations
            2. 9.2.1.2 Input Considerations
            3. 9.2.1.3 Output Considerations
          2. 9.2.2 Detailed Design Procedure
          3. 9.2.3 Application Curves
            1.         Power Supply Recommendations
  9. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
      1.      Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Trademarks

TI E2E™ is a trademark of Texas Instruments.

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