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ZHCSNX7F December 1982 – April 2021 SN54HC32 , SN74HC32

PRODUCTION DATA

6.4 Thermal Information - 74

THERMAL METRIC⁽¹⁾		SN74HC32					UNIT
		D (SOIC)	DB (SSOP)	N (PDIP)	NS (SOP)	PW (TSSOP)
		14 PINS	14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	133.6	111.3	67.0	122.6	151.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	89.0	61.2	55.0	81.8	79.4	°C/W
R_θJB	Junction-to-board thermal resistance	89.5	61.6	46.7	83.8	94.7	°C/W
Ψ_JT	Junction-to-top characterization parameter	45.5	20.8	35.1	45.4	25.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	89.1	60.9	46.5	83.4	94.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.