ZHCSNX7F December   1982  – April 2021 SN54HC32 , SN74HC32

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information - 74
    5. 6.5  Thermal Information - 54
    6. 6.6  Electrical Characteristics - 74
    7. 6.7  Electrical Characteristics - 54
    8. 6.8  Switching Characteristics - 74
    9. 6.9  Switching Characteristics - 54
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
      1.      Application and Implementation
        1. 9.1 Application Information
        2. 9.2 Typical Application
          1. 9.2.1 Design Requirements
            1. 9.2.1.1 Power Considerations
            2. 9.2.1.2 Input Considerations
            3. 9.2.1.3 Output Considerations
          2. 9.2.2 Detailed Design Procedure
          3. 9.2.3 Application Curves
            1.         Power Supply Recommendations
  9. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
      1.      Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Detailed Design Procedure

  1. Add a decoupling capacitor from VCC to GND. The capacitor needs to be placed physically close to the device and electrically close to both the VCC and GND pins. An example layout is shown in GUID-AD3C4E3C-E98F-48DA-8856-6822CEC7B543.html#GUID-AD3C4E3C-E98F-48DA-8856-6822CEC7B543.
  2. Ensure the capacitive load at the output is ≤ 70 pF. This is not a hard limit, however it will ensure optimal performance. This can be accomplished by providing short, appropriately sized traces from the SN74HC32 to the receiving device.
  3. Ensure the resistive load at the output is larger than (VCC / IO(max)) Ω. This will ensure that the maximum output current from the Absolute Maximum Ratings is not violated. Most CMOS inputs have a resistive load measured in megaohms; much larger than the minimum calculated above.
  4. Thermal issues are rarely a concern for logic gates, however the power consumption and thermal increase can be calculated using the steps provided in the application report, CMOS Power Consumption and Cpd Calculation