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ZHCSPW2F January 1996 – June 2022 SN54HC368 , SN74HC368

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC		D (SOIC)	N (PDIP)	NS (SO)	PW (TSSOP)	UNIT
THERMAL METRIC		16 PINS	16 PINS	16 PINS	16 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	117.2	68.6	87.4	137.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	77.2	61.1	44.9	75.3	°C/W
R_θJB	Junction-to-board thermal resistance	75.6	48.6	49.6	82.2	°C/W
ψ_JT	Junction-to-top characterization parameter	38.1	33.9	12.2	25.1	°C/W
ψ_JB	Junction-to-board characterization parameter	75.3	48.4	49.2	81.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.