米6体育平台手机版

ZHCSJ94K March 1996 – February 2024 SN74HC4066

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HC4066		UNIT
		D (SOIC)	PW (TSSOP)
		14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	127.8	150.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	81.8	78.2	°C/W
R_θJB	Junction-to-board thermal resistance	84.2	93.7	°C/W
ψ_JT	Junction-to-top characterization parameter	39.5	24.6	°C/W
ψ_JB	Junction-to-board characterization parameter	83.7	93.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.