ZHCSWJ3B December   2006  – June 2024 SN74HC4852-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information: SN74HC485x-Q1
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7. 5.7 Injection Current Coupling
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Functional Block Diagram
  9. Application and Implementation
    1. 8.1 Application Information
  10. Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information: SN74HC485x-Q1

THERMAL METRIC(1) SN74HC485x-Q1 UNIT
PW (TSSOP)
PINS
RθJA Junction-to-ambient thermal resistance  139.6 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.