米6体育平台手机版

ZHCSRK2F March 1984 – April 2021 SN74HC7001

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HC7001			UNIT
		D (SOIC)	N (PDIP)	NS (SOP)
		14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	133.6	61.4	122.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	89.0	49.2	81.8	°C/W
R_θJB	Junction-to-board thermal resistance	89.5	41.2	83.8	°C/W
Ψ_JT	Junction-to-top characterization parameter	45.5	28.8	45.4	°C/W
Ψ_JB	Junction-to-board characterization parameter	89.1	40.9	83.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.