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ZHCSRN1F December 1982 – April 2021 SN54HC86 , SN74HC86

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HC86				UNIT
		D (SOIC)	N (PDIP)	NS (SOP)	PW (TSSOP)
		14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	133.6	62.8	122.6	151.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	89.0	50.5	81.8	79.4	°C/W
R_θJB	Junction-to-board thermal resistance	89.5	42.5	83.8	94.7	°C/W
Ψ_JT	Junction-to-top characterization parameter	45.5	30.1	45.4	25.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	89.1	42.3	83.4	94.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.