米6体育平台手机版

ZHCSKW0C December 2019 – December 2021 SN74HCS00

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74HCS00				UNIT
		PW (TSSOP)	D (SOIC)	BQA (WQFN)	DYY (SOT)
		14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	151.7	133.6	109.7	236.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	79.4	89.0	111.0	143.2	°C/W
R_θJB	Junction-to-board thermal resistance	94.7	89.5	77.9	146.0	°C/W
Ψ_JT	Junction-to-top characterization parameter	25.2	45.5	20.2	29.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	94.1	89.1	77.8	145.6	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	56.6	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.